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Soldering bga systems


Soldering bga systems

Installments
Soldering bga systems
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FRAMEWORK COURSE PLAN:

  1. Terms and conditions conditions resulting from the BGA data.
  2. Preparation and practical application of temperature profiles for electronic components.
  3. Preparation of the BGA system for the reballing process.
  4. Solder replacement - overview of the process.
  5. Preparing the motherboard for disassembly of the BGA chip, proper protection of components sensitive to high temperatures.
  6. Disassembly of the BGA using the time profile.
  7. Cleaning and inspection of the board after disassembling the BGA.
  8. Preparation for the assembly of a new system.
  9. Installation of the system with the use of time profiles.
  10. Cleaning and arming the motherboard after replacing the BGA chip.

TIME - 40 TEACHING HOURS

PREREQUISITES BEFORE TRAINING:
There are no special requirements for participants. Manual skills, basic electronic knowledge and basic ability to read schematic diagrams and boardview are welcome.

price: 3500zł

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